New ExtraBond (NEB1 and NEB2).

DEI® New Extra Bond One is a monocomponent adhesive that can be used in combination with all the techniques of etching: self-etch, selective-enamel-etch and total-etch-and-rinse. It is also indicated for both direct and indirect restorations, and for luting procedures of light-curing or dual-curing composites.
DEI® New Extra Bond One comes up in two parts (adhesive and catalyst).
DEI® New Extra Bond One can be directly applied without the need of pre-etching the dentine with phosphoric acid.

DEI® New Extra Bond One tolerates the presence of residual moisture, it can also be used in a universal way with any etching technique both in enamel and in dentine (self-etch, selective-enamel-etch and total-etch-and-rinse). DEI® New Extra Bond One can also be used in a universal way with any type of light-curing, self-curing and dual-curing composites.

Due to its specific formulation and the presence of silica nanoparticles, this adhesive system allows the creation of durable bond to the hard dental tissues by light-curing or dual curing (if previously mixed with the appropriate catalyst, DEI® New Extra Catalyst One).
The new functional monomer acid GDMA-P created for DEI® New Extra Bond One guarantees a stable and lasting bonding performance sue to its chemical structure characterised by a hydrophobic chain, which ensures a good resistance to hydrolytic degradation. Moreover, its phosphoric functional groups allow a strong chemical bond with calcium ions present in the dental hydroxyapatite, without engaging the operator in complex sequences of applications.

This special formula allows DEI® New Extra Bond One to be employed for indirect restorations (onlays, inlays, veener), bridges and crowns through dual and self-curing resin systems, without polymerizing the adhesive layer in advance. This is often a decisive factor when one wants to reach difficult areas with the curing light.

NEB 1 also contain:

Diphenyliodonium hexafluorophosphate (DPIHP) for better polymerization of hydrophilic monomers in presence of solvents

Antioxidants. They appear to reduce the potential degradation effects of free radicals and hydrolysis

pH: ~3

No Bis-GMA. Low cytotoxicity 

 

 

 

 

DEI® New Extra Bond TWO is a multi-step adhesive that can be used in combination with all the techniques of etching: self-etch, selective-enamel-etch and total-etch-and-rinse. It is also indicated for both direct and indirect restorations, and for luting procedures of light-curing or dual-curing composites.
DEI® New Extra Bond TWO comes up in three parts (primer, adhesive and catalyst).
DEI® New Extra Bond TWO can be directly applied without the need of pre-etching the dentine with phosphoric acid.

DEI® New Extra Bond One tolerates the presence of residual moisture, it can also be used in a universal way with any etching technique both in enamel and in dentine (self-etch, selective-enamel-etch and total-etch-and-rinse). DEI® New Extra Bond One can also be used in a universal way with any type of light-curing, self-curing and dual-curing composites.

NEB 2 also contain:

Diphenyliodonium hexafluorophosphate (DPIHP) for better polymerization of hydrophilic monomers in presence of solvents

Antioxidants. They appear to reduce the potential degradation effects of free radicals and hydrolysis

pH: ~3

No Bis-GMA. Low cytotoxicity